IBM Expands Canadian Facility with $187 Million Investment to Boost North American Semiconductor Capabilities

IBM’s $187 million investment in the Bromont facility enhances semiconductor packaging capabilities, supporting North American semiconductor needs.

IBM has recently announced a significant investment plan in collaboration with the Canadian federal and Quebec provincial governments.

The plan involves an investment of $187 million CAD (approximately 11.4 Billion INR or 993 million RMB) to upgrade the Bromont semiconductor packaging facility’s capacity and technology.

This initiative is crucial as semiconductor fabrication increasingly requires advanced packaging due to miniaturization.

The Bromont facility, operational for 52 years, specializes in packaging IBM Power series processors and offers semiconductor module assembly, testing, and packaging services, making it one of North America’s largest OAST (Outsourced Assembly and Test) facilities.

Additionally, the investment will fund research into heterogeneous chip packaging integration, which is vital for creating AI inference systems with substantial onboard memory.

This funding will also strengthen IBM’s collaboration with Canadian SMEs (Small and Medium-sized Enterprises), further developing the semiconductor ecosystem.

Dario Gil, IBM’s Senior Vice President and Director of Research emphasized the growing computational demands of the AI era and the critical role of advanced packaging and chip technologies in meeting these needs.

As North America’s largest chip assembly and testing factory, IBM’s Bromont facility is set to play a pivotal role in the future of semiconductor innovation.

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Aditya Nath Jha is an Engineer from New Delhi, India. His areas of interest include Gadgets, WordPress, speed optimization & latest technology. When he is not busy blogging he loves to write poetry, compose his own songs and has a taste for music! Find him on Facebook, Twitter, Linked in, Instagram. And watch his videos on YouTube.

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IBM Expands Canadian Facility with $187 Million Investment to Boost North American Semiconductor Capabilities

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