MediaTek Dimensity 7300, 7300X Processors Launched: 4nm, 8-Core CPU

MediaTek unveils Dimensity 7300 and 7300X processors with 4nm process, 8-core CPU, supporting 200MP camera, Wi-Fi 6E, and advanced AI features.

HSINCHU, Taiwan – May 30, 2024 – MediaTek has introduced the Dimensity 7300 and the Dimensity 7300X, two ultra-efficient 4nm chips designed for advanced mobile devices. These chipsets deliver exceptional power efficiency and performance, enabling seamless multitasking, superior photography, enhanced gaming, and AI-driven computing. The Dimensity 7300X, specifically tailored for flip-style foldable devices, supports dual displays.

Both Dimensity 7300 chipsets feature an octa-core CPU with 4 Arm Cortex-A78 cores running at up to 2.5GHz, paired with 4 Arm Cortex-A55 cores. The 4nm process reduces power consumption in the A78 cores by up to 25% compared to the Dimensity 7050.

The CPU is complemented by the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimizations to enhance gaming performance. Compared to competitors, the Dimensity 7300 series offers 20% faster FPS and 20% better energy efficiency.

To further improve gaming, these chips utilize smart resource optimization, enhance 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

“The MediaTek Dimensity 7300 chips will be crucial for integrating the latest AI enhancements and connectivity features, allowing consumers to seamlessly stream and game,”

said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business.

“Moreover, the Dimensity 7300X enables OEMs to develop innovative new form factors with its dual display support.”

The Dimensity 7300 chipsets also enhance photography with the MediaTek Imagiq 950, featuring a premium 12-bit HDR-ISP supporting a 200MP main camera. New hardware engines provide precise noise reduction (MCNR), face detection (HWFD), and video HDR, allowing users to capture stunning images and videos in any lighting.

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Live focus photo performance is up to 1.3 times faster, and photo remastering is up to 1.5 times faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range than competitor solutions, revealing more details in videos.

The MediaTek APU 655 greatly enhances AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also support new mixed-precision data types, optimizing memory bandwidth and reducing memory requirements for larger AI models.

With MediaTek’s MiraVision 955, the Dimensity 7300 SoCs support detailed WFHD+ displays with 10-bit true color and global HDR standards, improving media streaming and playback. The Dimensity 7300X’s dedicated support for dual-display flip phones helps OEMs meet the growing demand for innovative form factors.

Other key features of the Dimensity 7300 and Dimensity 7300X include:

  • MediaTek 5G UltraSave 3.0+ technology, incorporating a suite of R16 power-saving enhancements and MediaTek’s optimizations, providing 13-30% greater power efficiency in common 5G sub-6GHz connectivity scenarios compared to competitors.
  • Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, offering faster downlink speeds in urban and suburban environments.
  • Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
  • Dual 5G SIM support with dual VoNR, giving users more options.

The Motorola Razr 50 foldable phone will include the Dimensity 7300X, achieving GeekBench scores of 1033 (single-core) and 2751 (multi-core).

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MediaTek Dimensity 7300, 7300X Processors Launched: 4nm, 8-Core CPU

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