Memory Giants Battle for Broadcom’s HBM3E Orders

Major memory manufacturers Samsung, SK Hynix, and Micron compete for Broadcom’s HBM3E memory orders, pivotal for advanced AI hardware.

The battle for HBM3E memory orders continues as the three major memory companies, Samsung Electronics, SK Hynix, and Micron, target Broadcom’s needs.

Following competition for NVIDIA and AMD’s AI GPU / accelerator HBM3E memory contracts, these companies have set their sights on Broadcom, which achieved semiconductor-related revenues of $29.95 billion last year, ranking third among fabless design companies, only behind NVIDIA and Qualcomm.

Broadcom mainly uses HBM memory in switch chips and ASIC designs within its operations.

Since at least 2019, Broadcom has been incorporating HBM memory in some switch chips as data buffers to meet the demands for high bandwidth and low latency that traditional packaged external DRAM cannot satisfy.

In the ASIC design sector, Broadcom designs custom chips for companies like Google and Meta, with Google’s TPU series being among the most representative products.

Source: X User @PatrickMoorhead

During a March investor event, Broadcom showcased a large XPU chip, a custom ASIC that included 12 HBM memory stacks.

It was reported that Broadcom plans to use HBM3E memory in AI servers built around Google’s TPU chips.

Samsung Electronics, SK Hynix, and Micron have already supplied Broadcom with early samples of 8-layer stacked HBM3E memory; Broadcom is concurrently testing samples from all three suppliers, who will also provide improved subsequent samples within this quarter.

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Memory Giants Battle for Broadcom’s HBM3E Orders

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