On May 13, it was reported that due to the rapid growth of generative AI, there has been an increase in the need for GPUs. Consequently, Nvidia has taken steps to boost GPU production by placing additional orders with TSMC.
According to reports, Nvidia has expanded its orders for CoWoS (wafer-level chip) packaging to TSMC. Furthermore, they have decided to increase the volume by an additional 10,000 units in 2023 to meet the surging demand.
According to the sources, the report did not provide specific details regarding which GPU models Nvidia intends to add.
However, it did mention that TSMC will increase its monthly production capacity by an additional 1,000-2,000 wafers for the remainder of this year. TSMC’s current CoWoS packaging capacity ranges between 8,000 and 9,000 wafers per month.
The NVIDIA CUDA platform has gained significant popularity in the field of AI and other high-performance workloads. Numerous prominent customers rely on Nvidia’s hardware to power their AI applications.
Just recently, Google made an announcement about its latest A3 supercomputer, equipped with 26,000 NVIDIA H100 accelerators and boasting an impressive 26 exaflops of AI capabilities.
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