According to DigiTimes, TSMC has already received orders for all 5G modem chips from various chip makers, such as Qualcomm’s Snapdragon X50 and HiSilicon’s Balong series used by Huawei.
According to industry sources, TSMC has begun producing 5G modem chips for Qualcomm and Hisilicon and is preparing to produce MediaTek’s Helio M70 5G modem in the second half of 2019. All 5G modem solutions are manufactured using TSMC’s 7nm process technology.
This will ensure that maybe future chipsets from these manufacturers might include better integration with 5G modems and lower power consumption as well.
According to sources, TSMC also received orders for 5G modems from Unisoc, formerly known as Unigroup Spreadtrum and RDA. They are scheduled to be mass-produced by the end of 2019 or early 2020. Unisoc originally planned to introduce a high-end 5G smartphone solution with an Intel modem but has launched its own 5G modem since then.
Unisoc has previously revealed that its first 5G modem with IVY510 will be manufactured using TSMC’s 12nm process technology.
Samsung Electronics recently announced that its 5G communications solution has been mass-produced for its latest high-end mobile devices. These include Samsung’s first 5G modem solution, the Exynos Modem 5100, which uses Samsung’s 10nm LPP process.
TSMC 5G modems: The future?
But from all of the news sources, it’s pretty clear that TSMC’s 7nm solution is currently superior. Qualcomm too had been facing quite some problems in the recent past as their Snapdragon 855 chipset required the external X50 baseband in order to be 5G compatible.
So guys what do you think? With all of these announcements is the 5G wave coming in sooner than expected? Do let us know in the comments section below!
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