Xiaomi’s New Mobile Phone Appears on Geekbench, Equipped With MediaTek Dimensity 8200-Ultra Chip!

The upcoming phone might be called the Xiaomi Civi 3.

May 20 marked the official declaration by Xiaomi that its forthcoming Civi3 will feature the world’s first Dimensity 8200-Ultra chip. This System on a Chip (SoC) has been specifically customized by MediaTek for the Civi3, thereby resulting in improved imaging and performance capabilities.

Geekbench, a well-known benchmarking database, has already listed the Civi3 under the model number 23046PNC9C, revealing that it will come furnished with 12GB of RAM and a pre-installed MIUI 13 system based on Android 13, in addition to the MediaTek Dimensity 8200 Ultra SoC.

xiaomi civi 3 geekbench benchmark

In terms of performance, the Civi3 scored 1148 points in the single-core test and 3356 points in the multi-core test on Geekbench 6, slightly surpassing the OnePlus 10R and realme GT Neo 3, which are equipped with the Dimensity 8100 Ultra.

According to previous leaks, the Civi3 will support 5G inter-network roaming, meaning that it can access different operators’ 5G networks without requiring a SIM card change.

For instance, if a user has a telecom SIM card but is located in an area with only mobile 5G coverage, the phone will prioritize connecting to mobile 5G.

The Civi3 is also expected to feature a front-facing dual-camera solution, with both sensors being 32-megapixel Samsung S5KGD2 sensors.

The rear camera is said to be equipped with a Sony IMX800 outsole main camera with Optical Image Stabilization (OIS). The phone’s display will support a high refresh rate of 120Hz, and it will come with a 4500mAh battery that supports 67W fast charging.

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Xiaomi’s New Mobile Phone Appears on Geekbench, Equipped With MediaTek Dimensity 8200-Ultra Chip!

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