MediaTek has announced the launch of the Dimensity 7200, designed to enhance mobile gaming and photography experiences on smartphones. The 4nm chipset offers state-of-the-art AI imaging capabilities, advanced gaming optimizations, and lightning-fast 5G speeds, while also delivering impressive power efficiency for extended battery life.
Featuring the same TSMC 4nm second-generation process as the Dimensity 9200, the Dimensity 7200 is perfect for ultra-slim smartphone designs in a range of form factors. It includes an octa-core CPU with two Arm Cortex-A715 cores operating at up to 2.8 GHz and six Cortex-A510 cores for seamless multitasking and optimal performance in every app.
The built-in AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI-fusion processing to further improve power and performance. According to CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit,
“The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts who are looking for an affordable way to squeeze the most battery life out of their phones without skimping on performance.”
For gamers, the chipset includes MediaTek HyperEngine 5.0 technology, which offers AI-based Variable Rate Shading (VRS) for power savings, as well as CPU and GPU smart resource optimization for improved battery life and other upgrades for seamless gameplay. The Arm Mali G610 GPU supports fast response times and high frame rates.
In terms of photography, the Dimensity 7200 incorporates MediaTek’s Imagiq 765 and a 14-bit HDR-ISP, allowing support for 200MP main cameras for incredible photography. It enables impressive 4K HDR video capture and even allows users to simultaneously capture content from two cameras at Full HD resolution while keeping everything in focus with all-pixel autofocus technology.
The chipset has built-in motion-compensated noise reduction for capturing stunning imagery at night and in low-light environments. Additionally, the APU supports powerful AI-Camera enhancements such as real-time portrait beautification. The Dimensity 7200 includes a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7 Gbps downlink, supporting triband Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. The fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite ensure best-in-class cellular power efficiency.
The chipset also supports 2CC Carrier Aggregation and Dual 5G SIM with dual VoNR for reliable coverage everywhere. The Dual SIM capability also lets users have two connections, making it easy to take work and personal calls from a single smartphone.
Other features of the Dimensity 7200 include up to 6400Mbps memory frequency and UFS 3.1 for maximum storage, MediaTek MiraVision Display with HDR supporting the latest standards including HDR10+, CUVA HDR, and Dolby HDR, up to Full HD+ and 144Hz for brilliant displays, AI SDR-to-HDR video playback for enhanced multimedia experiences, Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.
The Dimensity 7200 will power 5G devices launching in the global market in Q1 2023.
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